AGREEMENT

on trade in information technology products

WORLD TRADE ORGANIZATION

13 December 1996

MINISTERIAL CONFERENCE

Singapore, 9-13 December 1996

MINISTERIAL DECLARATION ON TRADE IN INFORMATION TECHNOLOGY PRODUCTS

Singapore, 13 December 1996

MINISTERS,

REPRESENTING the following Members of the World Trade Organization (‘WTO’), and States or separate customs territories in the process of acceding to the WTO, which have agreed in Singapore on the expansion of world trade in information technology products and which account for well over 80 per cent of world trade in these products (‘parties’):

Australia

Canada

European Communities

Hong Kong

Iceland

Indonesia

Japan

Korea

Norway

Separate Customs Territory of Taiwan, Penghu, Kinmen and Matsu

Singapore

Switzerland(1)

Turkey

United States

CONSIDERING the key role of trade in information technology products in the development of information industries and in the dynamic expansion of the world economy,

RECOGNIZING the goals of raising standards of living and expanding the production of and trade in goods,

DESIRING to achieve maximum freedom of world trade in information technology products,

DESIRING to encourage the continued technological development of the information technology industry on a world-wide basis,

MINDFUL of the positive contribution information technology makes to global economic growth and welfare,

HAVING agreed to put into effect the results of these negotiations which involve concessions additional to those included in the Schedules attached to the Marrakesh Protocol to the General Agreement on Tariffs and Trade 1994, and

RECOGNIZING that the results of these negotiations also involve some concessions offered in negotiations leading to the establishment of Schedules annexed to the Marrakesh Protocol,

DECLARE as follows:

Each party's trade regime should evolve in a manner that enhances market access opportunities for information technology products.

Pursuant to the modalities set forth in the Annex to this Declaration, each party shall bind and eliminate customs duties and other duties and charges of any kind, within the meaning of Article II:1 (b) of the General Agreement on Tariffs and Trade 1994, with respect to the following:

(a) all products classified (or classifiable) with Harmonized System (1996) (‘HS’) headings listed in Attachment A to the Annex to this Declaration, and

(b) all products specified in Attachment B to the Annex to this Declaration, whether or not they are included in Attachment A,

through equal rate reductions of customs duties beginning in 1997 and concluding in 2000, recognizing that extended staging of reductions and, before implementation, expansion of product coverage may be necessary in limited circumstances.

Ministers express satisfaction about the large product coverage outlined in the Attachments to the Annex to this Declaration. They instruct their respective officials to make good faith efforts to finalize plurilateral technical discussions in Geneva on the basis of these modalities, and instruct these officials to complete this work by 31 January 1997, so as to ensure the implementation of this Declaration by the largest number of participants.

Ministers invite the Ministers of other Members of the WTO, and States or separate customs territories in the process of acceding to the WTO, to provide similar instructions to their respective officials, so that they may participate in the technical discussions referred to in paragraph 3 above and participate fully in the expansion of world trade in information technology products.

Annex:	Modalities and product coverage
	Attachment A:	list of HS headings
	Attachment B:	list of products

(1) On behalf of the customs union Switzerland and Liechtenstein.

ANNEX

MODALITIES AND PRODUCT COVERAGE

Any Member of the World Trade Organization, or State or separate customs territory in the process of acceding to the WTO, may participate in the expansion of world trade in information technology products in accordance with the following modalities:

Each participant shall incorporate the measures described in paragraph 2 of the Declaration into its schedule to the General Agreement on Tariffs and Trade 1994, and, in addition, at either its own tariff line level or the Harmonized System (1996) (‘HS’) 6-digit level in either its official tariff or any other published versions of the tariff schedule, whichever is ordinarily used by importers and exporters. Each participant that is not a Member of the WTO shall implement these measures on an autonomous basis, pending completion of its WTO accession, and shall incorporate these measures into its WTO market access schedule for goods.

To this end, as early as possible and no later than 1 March 1997 each participant shall provide all other participants a document containing (a) the details concerning how the appropriate duty treatment will be provided in its WTO schedule of concessions, and (b) a list of the detailed HS headings involved for products specified in Attachment B. These documents will be reviewed and approved on a consensus basis and this review process shall be completed no later than 1 April 1997. As soon as this review process has been completed for any such document, that document shall be submitted as a modification to the schedule of the participant concerned, in accordance with the Decision of 26 March 1980 on Procedures for Modification and Rectification of Schedules of Tariff Concessions (BISD 27S/25).

(a) The concessions to be proposed by each participant as modifications to its schedule shall bind and eliminate all customs duties and other duties and charges of any kind on information technology products as follows:

(i) elimination of such customs duties shall take place through rate reductions in equal steps, except as may be otherwise agreed by the participants. Unless otherwise agreed by the participants, each participant shall bind all tariffs on items listed in the Attachments no later than 1 July 1997, and shall make the first such rate reduction effective no later than 1 July 1997, the second such rate reduction no later than 1 January 1998, and the third such rate reduction no later than 1 January 1999, and the elimination of customs duties shall be effective no later than 1 January 2000. The participants agree to encourage autonomous elimination of customs duties prior to these dates. The reduced rate should in each stage be rounded off to the first decimal, and

(ii) elimination of such other duties and charges of any kind, within the meaning of Article II:1 (b) of the General Agreement, shall be completed by 1 July 1997, except as may be otherwise specified in the participant's document provided to other participants for review.

(b) The modifications to its schedule to be proposed by a participant in order to implement its binding and elimination of customs duties on information technology products shall achieve this result:

(i) in the case of the HS headings listed in Attachment A, by creating, where appropriate, subdivisions in its schedule at the national tariff line level, and

(ii) in the case of the products specified in Attachment B, by attaching an annex to its schedule including all products in Attachment B, which is to specify the detailed HS headings for those products at either the national tariff line level or the HS 6-digit level.

Each participant shall promptly modify its national tariff schedule to reflect the modifications it has proposed, as soon as they have entered into effect.

Participants shall meet periodically under the auspices of the Council on Trade in Goods to review the product coverage specified in the Attachments, with a view to agreeing by consensus whether, in the light of technological developments, experience in applying the tariff concessions, or changes to the HS nomenclature, the Attachments should be modified to incorporate additional products, and to consult on non-tariff barriers to trade in information technology products. Such consultations shall be without prejudice to rights and obligations under the WTO Agreement.

Participants shall meet as soon as practicable and in any case no later than 1 April 1997 to review the state of acceptances received and to assess the conclusions to be drawn therefrom. Participants will implement the actions foreseen in the Declaration provided that participants representing approximately 90 per cent of world trade(1) in information technology products have by then notified their acceptance, and provided that the staging has been agreed to the participants' satisfaction. In assessing whether to implement actions foreseen in the Declaration, if the percentage of world trade represented by participants falls somewhat short of 90 per cent of world trade in information technology products, participants may take into account the extent of the participation of States or separate customs territories representing for them the substantial bulk of their own trade in such products. At this meeting the participants will establish whether these criteria have been met.

Participants shall meet as often as necessary and no later than 30 September 1997 to consider any divergence among them in classifying information technology products, beginning with the products specified in Attachment B. Participants agree on the common objective of achieving, where appropriate, a common classification for these products within existing HS nomenclature, giving consideration to interpretations and rulings of the Customs Cooperation Council (also known as the World Customs Organization or ‘WCO’). In any instance in which a divergence in classification remains, participants will consider whether a joint suggestion could be made to the WCO with regard to updating existing HS nomenclature or resolving divergence in interpretation of the HS nomenclature.

The participants understand that Article XXIII of the General Agreement will address nullification or impairment of benefits accruing directly or indirectly to a WTO Member participant through the implementation of this Declaration as a result of the application by another WTO Member participant of any measure, whether or not that measure conflicts with the provisions of the General Agreement.

Each participant shall afford sympathetic consideration to any request for consultation from any other participant concerning the undertakings set out above. Such consultations shall be without prejudice to rights and obligations under the WTO Agreement.

Participants acting under the auspices of the Council for Trade in Goods shall inform other Members of the WTO and States or separate customs territories in the process of acceding to the WTO of these modalities and initiate consultations with a view to facilitate their participation in the expansion of trade in information technology products on the basis of the Declaration.

As used in these modalities, the term ‘participant’ shall mean those Members of the WTO, or States or separate customs territories in the process of acceding to the WTO, that provide the document described in paragraph 2 no later than 1 March 1997.

10.

This Annex shall be open for acceptance by all Members of the WTO and any State or any separate customs territory in the process of acceding to the WTO. Acceptances shall be notified in writing to the Director-General who shall communicate them to all participants.

There are two Attachments to the Annex.

Attachment A lists the HS headings or parts thereof to be covered.

Attachment B lists specific products to be covered by an ITA wherever they are classified in the HS.

(1) This percentage shall be calculated by the WTO Secretariat on the basis of the most recent data available at the time of the meeting.

Attachment A, Section 1

HS 96

HS description

3818

Chemical elements doped for use in electronics, in form of discs, wafers or similar forms; chemical compounds doped for use in electronics

8469 11

Word processing machines

8470

Calculating machines and pocket-size data recording, reproducing and displaying machines with a calculating function; accounting machines, postage franking machines, ticket-issuing machines and similar machines, incorporating a calculating device; cash registers:

8470 10

Electronic calculators capable of operating without an external source of electric power and pocket size data recording, reproducing and displaying machines with calculating functions

8470 21

Other electronic calculating machines incorporating a printing device

8470 29

Other

8470 30

Other calculating machines

8470 40

Accounting machines

8470 50

Cash registers

8470 90

Other

8471

Automatic data processing machines and units thereof; magnetic or optical readers, machines for transcribing data onto data media in coded form and machines for processing such data, not elsewhere specified or included:

8471 10

Analogue or hybrid automatic data processing machines

8471 30

Portable digital automatic data processing machines, weighing no more than 10 kg, consisting of at least a central processing unit, a keyboard and a display

8471 41

Other digital automatic data processing machines comprising in the same housing at least a central processing unit and an input and output unit, whether or not combined

8471 49

Other digital automatic data processing machines presented in the form of systems

8471 50

Digital processing units other than those of subheading 8471 41 and 8471 49, whether or not containing in the same housing one or two of the following types of units: storage units, input units, output units

8471 60

Input or output units, whether or not containing storage units in the same housing

8471 70

Storage units, including central storage units, optical disk storage units, hard disk drives and magnetic tape storage units

8471 80

Other units of automatic data processing machines

8471 90

Other

ex 8472 90

Automatic teller machines

8473 21

Parts and accessories of the machines of heading No 8470 of the electronic calculating machines of subheading 8470 10, 8470 21 and 8470 29

8473 29

Parts and accessories of the machines of heading No 8470 other than the electronic calculating machines of subheading 8470 10, 8470 21 and 8470 29

8473 30

Parts and accessories of the machines of heading No 8471

8473 50

Parts and accessories equally suitable for use with machines of two or more of the headings Nos 8469 to 8472

ex 8504 40

Static converters for automatic data processing machines and units thereof, and telecommunication apparatus

ex 8504 50

Other inductors for power supplies for automatic data processing machines and units thereof, and telecommunication apparatus

8517

Electrical apparatus for line telephony or line telegraphy, including line telephone sets with cordless handsets and telecommunication apparatus for carrier-current line systems or for digital line systems; videophones:

8517 11

Line telephone sets with cordless handsets

8517 19

Other telephone sets and videophones

8517 21

Facsimile machines

8517 22

Teleprinters

8517 30

Telephonic or telegraphic switching apparatus

8517 50

Other apparatus, for carrier-current line systems or for digital line systems

8517 80

Other apparatus including entry-phone systems

8517 90

Parts of apparatus of heading 8517

ex 8518 10

Microphones having a frequency range of 300 Hz to 3,4 KHz with a diameter not exceeding 10 mm and a height not exceeding 3 mm, for telecommunication use

ex 8518 30

Line telephone handsets

ex 8518 29

Loudspeakers, without housing, having a frequency range of 300 Hz to 3,4 KHz with a diameter not exceeding 50 mm, for telecommunication use

8520 20

Telephone answering machines

8523 11

Magnetic tapes of a width not exceeding 4 mm

8523 12

Magnetic tapes of a width exceeding 4 mm but not exceeding 6,5 mm

8523 13

Magnetic tapes of a width exceeding 6,5 mm

8523 20

Magnetic discs

8523 90

Other

8524 31

Discs for laser reading systems for reproducing phenomena other than sound or image

ex 8524 39

Other:

—	for reproducing representations of instructions, data, sound, and image, recorded in a machine readable binary form, and capable of being manipulated or providing interactivity to a user, by means of an automatic data processing machine

8524 40

Magnetic tapes for reproducing phenomena other than sound or image

8524 91

Media for reproducing phenomena other than sound or image

ex 8424 99

Other:

—	for reproducing representations of instructions, data, sound, and image, recorded in a machine readable binary form, and capable of being manipulated or providing interactivity to a user, by means of an automatic data processing machine

ex 8525 10

Transmission apparatus other than apparatus for radio-broadcasting or television

8525 20

Transmission apparatus incorporating reception apparatus

ex 8525 40

Digital still image video cameras

ex 8527 90

Portable receivers for calling, alerting or paging

ex 8529 10

Aerials or antennae of a kind used with apparatus for radio-telephony and radio-telegraphy

ex 8529 90

Parts of:

transmission apparatus other than apparatus for radio-broadcasting or television

transmission apparatus incorporating reception apparatus

digital still image video cameras

portable receivers for calling, alerting or paging

8531 20

Indicator panels incorporating liquid crystal devices (LCD) or light emitting diodes (LED)

ex 8531 90

Parts of apparatus of subheading 8531 20

8532

Electrical capacitors, fixed, variable or adjustable (pre-set):

8532 10

Fixed capacitors designed for use in 50/60 Hz circuits and having a reactive power handling capacity of not less than 0,5 kvar (power capacitors)

8532 21

Tantalum fixed capacitors

8532 22

Aluminium electrolytic fixed capacitors

8532 23

Ceramic dielectric, single layer fixed capacitors

8532 24

Ceramic dielectric, multilayer fixed capacitors

8532 25

Dielectric fixed capacitors of paper or plastics

8532 29

Other fixed capacitors

8532 30

Variable or adjustable (pre-set) capacitors

8532 90

Parts

8533

Electrical resistors (including rheostats and potentiometers), other than heating resistors:

8533 10

Fixed carbon resistors, composition or film types

853 321

Other fixed resistors for a power handling capacity not exceeding 20 W

8533 29

Other fixed resistors for a power handling capacity of 20 W or more

8533 31

Wirewound variable resistors, including rheostats and potentiometers, for a power handling capacity not exceeding 20 W

8533 39

Wirewound variable resistors, including rheostats and potentiometers, for a power handling capacity of 20 W or more

8533 40

Other variable resistors, including rheostats and potentiometers

8533 90

Parts

8534

Printed circuits

ex 8536 50

Electronic AC switches consisting of optically coupled input and output circuits (Insulated thyristor AC switches)

ex 8536 50

Electronic switches, including temperature protected electronic switches, consisting of a transistor and a logic chip (chip-on-chip technology) for a voltage not exceeding 1 000 V

ex 8536 50

Electromechanical snap-action switches for a current not exceeding 11 amps

ex 8536 69

Plugs and sockets for co-axial cables and printed circuits

ex 8536 90

Connection and contact elements for wires and cables

8541

Diodes, transistors and similar semiconductor devices; photosensitive semiconductor devices, including photovoltaic cells whether or not assembled in modules or made up into panels; light-emitting diodes; mounted piezo-electric crystals:

8541 10

Diodes, other than photosensitive or light-emitting diodes

8541 21

Transistors, other than photosensitive transistors, with a dissipation rate of less than 1 W

8541 29

Transistors, other than photosensitive transistors, with a dissipation rate of 1 W or more

8541 30

Thyristors, diacs and triacs, other than photosensitive devices

8541 40

Photosensitive semiconductor devices, including photovoltaic cells whether or not assembled in modules or made up into panels; light emitting diodes

8541 50

Other semiconductor devices

8541 60

Mounted piezo-electric crystals

8541 90

Parts

8542

Electronic integrated circuits and microassemblies

8542 12

Cards incorporating an electronic integrated circuit (‘smart’ cards)

8542 13

Metal oxide semiconductors (MOS technology)

8542 14

Circuits obtained by bipolar technology

8542 19

Other monolithic digital integrated circuits, including circuits obtained by a combination of bipolar and MOS technologies (BIMOS technology)

8542 30

Other monolithic integrated circuits

8542 40

Hybrid integrated circuits

8542 50

Electronic microassemblies

8542 90

Parts

8543 81

Proximity cards and tags

ex 8543 89

Electrical machines with translation or dictionary functions

ex 8544 41

Other electric conductors, for a voltage not exceeding 80 V, fitted with connectors, of a kind used for telecommunications

ex 8544 49

Other electric conductors, for a voltage not exceeding 80 V, not fitted with connectors, of a kind used for telecommunications

ex 8544 51

Other electric conductors, for a voltage exceeding 80 V but not exceeding 1000 V, fitted with connectors, of a kind used for telecommunications

8544 70

Optical fibre cables

9009 11

Electrostatic photocopying apparatus, operating by reproducing the original image directly onto the copy (direct process)

9009 21

Other photocopying apparatus, incorporating an optical system

9009 90

Parts and accessories

9026

Instruments and apparatus for measuring or checking the flow, level, pressure or other variables of liquids or gases (for example, flow meters, level gauges, manometers, heat meters), excluding instruments and apparatus of heading Nos 9014, 9015, 9028 or 9032:

9026 10

Instruments for measuring or checking the flow or level of liquids

9026 20

Instruments and apparatus for measuring or checking pressure

9026 80

Other instruments and apparatus for measuring or checking of heading 9026

9026 90

Parts and accessories of instruments and apparatus of heading 9026

9027 20

Chromatographs and electrophoresis instruments

9027 30

Spectrometers, spectrophotometers and spectrographs using optical radiations (UV, visible, IR)

9027 50

Other instruments and apparatus using optical radiations (UV, visible, IR) of heading No 9027

9027 80

Other instruments and apparatus of heading No 9027 (other than those of heading No 9027 10)

ex 9027 90

Parts and accessories of products of heading 9027, other than for gas or smoke analysis apparatus and microtomes

9030 40

Instruments and apparatus for measuring and checking, specially designed for telecommunications (for example, cross-talk meters, gain measuring instruments, distorsion factor meters, photometers)

Attachment A, Section 2

Semiconductor manufacturing and testing equipment and parts thereof

HS code	Description	Comments
ex 7017 10	Quartz reactor tubes and holders designed for insertion into diffusion and oxidation furnaces for production of semiconductor wafers	For Attachment B
ex 8419 89	Chemical vapor deposition apparatus for semiconductor production	For Attachment B
ex 8419 90	Parts of chemical vapor deposition apparatus for semiconductor production	For Attachment B
ex 8421 19	Spin dryers for semiconductor wafer processing
ex 8421 91	Parts of spin dryers for semiconductor wafer processing
ex 8424 89	Deflash machines for cleaning and removing contaminants from the metal leads of semiconductor packages prior to the electroplating process
ex 8424 89	Spraying appliances for etching, stripping or cleaning semiconductor wafers
ex 8424 90	Parts of spraying appliances for etching, stripping or cleaning semiconductor wafers
ex 8456 10	Machines for working any material by removal of material, by laser or other light or photo beam in the production of semiconductor wafers
ex 8456 91	Apparatus for stripping or cleaning semiconductor wafers	For Attachment B
8456 91	Machines for dry-etching patterns on semiconductor materials
ex 8456 99	Focused ion beam milling machines to produce or repair masks and reticles for patterns on semiconductor devices
ex 8456 99	Lasercutters for cutting contacting tracks in semiconductor production by laser beam	For Attachment B
ex 8464 10	Machines for sawing monocrystal semiconductor boules into slices, or wafers into chips	For Attachment B
ex 8464 20	Grinding, polishing and lapping machines for processing of semiconductor wafers
ex 8464 90	Dicing machines for scribing or scoring semiconductor wafers
ex 8466 91	Parts for machines for sawing monocrystal semiconductor boules into slices, or wafers into chips	For Attachment B
ex 8466 91	Parts of dicing machines for scribing or scoring semiconductor wafers	For Attachment B
ex 8466 91	Parts of grinding, polishing and lapping machines for processing of semiconductor wafers
ex 8466 93	Parts of focused ion beam milling machines to produce or repair masks and reticles for patterns on semiconductor devices
ex 8466 93	Parts of lasercutters for cutting contacting tracks in semiconductor production by laser beam	For Attachment B
ex 8466 93	Parts of machines for working any material by removal of material, by laser or other light or photo beam in the production of semiconductor wafers
ex 8466 93	Parts of apparatus for stripping or cleaning semiconductor wafers	For Attachment B
ex 8466 93	Parts of machines for dry-etching patterns on semiconductor materials
ex 8477 10	Encapsulation equipment for assembly of semiconductors	For Attachment B
ex 8477 90	Parts of encapsulation equipment	For Attachment B
ex 8479 50	Automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other material for semiconductor devices	For Attachment B
ex 8479 89	Apparatus for growing or pulling rnonocrystal semiconductor boules
ex 8479 89	Apparatus for physical deposition by sputtering on semiconductor wafers	For Attachment B
ex 8479 89	Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays	For Attachment B
ex 8479 89	Die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors	For Attachment B
ex 8479 89	Encapsulation equipment for assembly of semiconductors	For Attachment B
ex 8479 89	Epitaxial deposition machines for semiconductor wafers
ex 8479 89	Machines for bending, folding and straightening semiconductor leads	For Attachment B
ex 8479 89	Physical deposition apparatus for semiconductor production	For Attachment B
ex 8479 89	Spinners for coating photographic emulsions on semiconductor wafers	For Attachment B
ex 8479 90	Part of apparatus for physical deposition by sputtering on semiconductor wafers	For Attachment B
ex 8479 90	Parts for die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors	For Attachment B
ex 8479 90	Parts for spinners for coating photographic emulsions on semiconductor wafers	For Attachment B
ex 8479 90	Parts of apparatus for growing or pulling monocrystal semiconductor boules
ex 8479 90	Parts of apparatus for wet etching, developing, stripping or cleaning semiconductors wafers and flat panel displays	For Attachment B
ex 8479 90	Parts of automated machines for transport, handling and storage for semiconductor wafers, wafer cassettes, wafer boxes and other material for semiconductor devices	For Attachment B
ex 8479 90	Parts of encapsulation equipment for assembly of semiconductors	For Attachment B
ex 8479 90	Parts of epitaxial deposition machines for semiconductor wafers
ex 8479 90	Parts of machines for bending, folding and straightening semiconductor leads	For Attachment B
ex 847 990	Parts of physical deposition apparatus for semiconductor production	For Attachment B
ex 8480 71	Injection and compression moulds for the manufacture of semiconductor devices
ex 8514 10	Resistance heated furnaces and ovens for the manufacture of semiconductor devices on semiconductor wafers
ex 8514 20	Inductance or dielectric furnaces and ovens for the manufacture of semiconductor devices on semiconductors wafers
ex 8514 30	Apparatus for rapid heating of semiconductor wafers	For Attachment B
ex 8514 30	Parts of resistance heated furnaces and ovens for the manufacture of semiconductor devices on semiconductor wafers
ex 8514 90	Parts of apparatus for rapid heating of wafers	For Attachment B
ex 8514 90	Parts of furnaces and ovens of Headings No 841410 to No 8514 30
ex 8536 90	Wafer probers	For Attachment B
8543 11	Ion implanters for doping semiconductor materials
ex 8543 30	Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays	For Attachment B
ex 8543 90	Parts of apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays	For Attachment B
ex 8543 90	Parts of ion implanters for doping semiconductor materials
9010 41 to 9010 49	Apparatus for projection, drawing or plating circuit patterns on sensitized semiconductor materials and flat panel displays
ex 9010 90	Parts and accessories of the apparatus of Headings No 9010 41 to 9010 49
ex 9011 10	Optical stereoscopic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles	For Attachment B
ex 9011 20	Photomicrographic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles	For Attachment B
ex 9011 90	Parts and accessories of optical stereoscopic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles	For Attachment B
ex 9011 90	Parts and accessories of photomicrographic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles	For Attachment B
ex 9012 10	Electron beam microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles	For Attachment B
ex 9012 90	Parts and accessories of electron beam microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles	For Attachment B
ex 9017 20	Pattern generating apparatus of a kind used for producing masks or reticles from photoresist coated substrates	For Attachment B
ex 9017 90	Parts and accessories for pattern generating apparatus of a kind used for producing masks or reticles from photoresist coated substrates	For Attachment B
ex 9017 90	Parts of such pattern generating apparatus	For Attachment B
9030 82	Instruments and apparatus for measuring or checking semiconductor wafers or devices
ex 9030 90	Parts and accessoires of instruments and apparatus for measuring or checking semiconductor wafers or devices
ex 9030 90	Parts of instruments and appliances for measuring or checking semiconductor wafers or devices
ex 9031 41	Optical instruments and appliances for inspecting semiconductor wafers or devices or for inspecting masks, photomasks or reticles used in manufacturing semiconductor devices
ex 9031 49	Optical instruments and appliances for measuring surface particulate contamination on semiconductor wafers
ex 9031 90	Parts and accessories of optical instruments and appliances for inspecting semiconductor wafers or devices or for inspecting masks, photomasks or reticles used in manufacturing semiconductor devices
9031 90	Parts and accessories of optical instruments and appliances for measuring surface particulate contamination on semiconductor wafers

Attachment B

Positive list of specific products to be covered by this agreement wherever they are classified in the HS.

Where parts are specified, they are to be covered in accordance with HS Notes 2 (b) to Section XVI and Chapter 90, respectively.

— Computers: automatic data processing machines capable of (1) storing the processing program or programs and at least the data immediately necessary for the execution of the program; (2) being freely programmed in accordance with the requirements of the user; (3) performing arithmetical computations specified by the user; and (4) executing, without human intervention, a processing program which requires them to modify their execution, by logical decision during the processing run.

The agreement covers such automatic data processing machines whether or not they are able to receive and process with the assistance of central processing unit telephony signals, television signals, or other analogue or digitally processed audio or video signals. Machines performing a specific function other than data processing, or incorporating or working in conjunction with an automatic data processing machine, and not otherwise specified under Attachment A or B, are not covered by this agreement,

— Electric amplifiers when used as repeaters in line telephony products falling within this agreement, and parts thereof,

— Flat panel displays (including LCD, electro luminescence, plasma and other technologies) for products falling within this agreement, and parts thereof,

— Network equipment: local area network (LAN) and wide area network (WAN) apparatus, including those products dedicated for use solely or principally to permit the interconnection of automatic data processing machines and units thereof for a network that is used primarily for the sharing of resources such as central processor units, data storage devices and input or output — including adapters, hubs, in-line repeaters, converters, concentrators, bridges and routers and printed circuit assemblies for physical incorporation into automatic data processing machines and units thereof,

— Monitors: display units of automatic data processing machines with a cathode ray tube with a dot screen pitch smaller than 0,4 mm not capable of receiving and processing television signals or other analogue or digitally processed audio or video signals without assistance of a central processing unit of a computer as defined in this agreement. The agreement does not, therefore, cover televisions, including high definition televisions(1),

— Optical disc storage units, for automatic data processing machines (including CD drives and DVD-drives), whether or not having the capability of writing/recording as well as reading, whether or not in their own housings,

— Paging alert devices, and parts thereof,

— Plotters whether input or output units of HS heading No 8471 or drawing or drafting machines of HS heading No 9017,

— Printed circuit assemblies for products falling within this agreement, including such assemblies for external connections such as cards that conform to the PCMCIA standard.

Such printed circuit assemblies consist of one or more printed circuits of heading 8534 with one or more active elements assembled thereon, with or without passive elements ‘Active elements’ means diodes, transistors, and similar semiconductor devices, whether or not photosensitive, of heading 8541, and integrated circuits and micro assemblies of heading 8542,

— Projection type flat panel display units used with automatic data processing machines which can display digital information generated by the central processing unit,

— Proprietary format storage devices including media therefore for automatic data processing machines, with or without removable media and whether magnetic, optical or other technology, including Bernouilli Box, Syquest, or Zipdrive cartridge storage units,

— Multimedia upgrade kits for automatic data processing machines, and units thereof, put up for retail sale, consisting of, at least, speakers and/or microphones as well as a printed circuit assembly that enables the ADP machines and units thereof to process audio signals (sound cards),

— Set top boxes which have a communication function: a microprocessor-based device incorporating a modem for gaining access to the Internet, and having a function of interactive information exchange.

(1) Participants will conduct a review of this product description in January 1999 under the consultation provisions of paragraph 3 of the Declaration.

AGREEMENT

on trade in information technology products

WORLD TRADE ORGANIZATION

ANNEX

MODALITIES AND PRODUCT COVERAGE

Attachment A, Section 1

Attachment A, Section 2

Attachment B

EC — ITA — Schedule CXL